Introducing boron nitride with excellent thermal conductivity. Achieving void-free formation through a special manufacturing process! 【Balancing low dielectric and high heat dissipation】
Our company's "HP-40 Series Boron Nitride Powder for Electronic Materials" is suitable for applications that require strict insulation properties and excellent heat dissipation characteristics, such as power modules.
It is used as a high thermal conductivity filler in heat dissipation sheets and metal-based substrates, utilizing an aggregated filler that eliminates the anisotropy of boron nitride. It is implemented in products with thermal conductivity of 12 W/mk or higher, and is currently being developed at levels of 15 to 20 W/mk.
We have achieved high filling in thermosetting resins such as epoxy resin, polyimide, and acrylic resin, balancing low dielectric properties and high thermal conductivity for the upcoming 5G and 6G communications.
In addition to excellent insulation and uniform dispersion, it possesses stable performance characteristics such as moderate aggregation strength.
We are also happy to provide additional suggestions, so please refer to the PDF materials for more details or feel free to contact us.